CGA 4 J 3 X 7 R 1 C 225 Kデータシートサマリー:主な仕様とテストデータ
Core Electrical Parameters
Extracted directly from the manufacturer datasheet for BOM verification and production qualification.
| Parameter | Value / Test Condition |
|---|---|
| Nominal Capacitance | 2.2 µF |
| Tolerance | ±10% (standard) / ±20% variant |
| Rated Voltage | 16 V DC |
| Dielectric | X7R |
| Package | 0805 (2012 metric) |
| Rated Temperature | -55°C to +125°C |
| Standard Test | 1 kHz, 0.5–1.0 Vrms |
Mechanical & Compliance Data
- Typical package dimensions: 2012 metric; refer to land pattern on datasheet for precise pad sizes and solder fillet expectations.
- Terminations: Tin/lead-free finish, RoHS compliant; peak reflow temperature typically up to 260°C with controlled ramp/soak profiles.
- Storage/Handling: Shelf life and baking requirements apply—bake per supplier guidelines if parts are exposed to humidity beyond recommended duration.
Electrical Performance & Data Analysis
Capacitance vs. DC Bias & Frequency
Quantifying DC-bias sensitivity is critical for effective circuit design. X7R devices experience significant capacitance loss as voltage increases.
0 V (100%)
2.20µF
2 V (90%)
1.98µF
5 V (70%)
1.54µF
10 V (60%)
1.32µF
16 V (50%)
1.10µF
Note: X7R devices can lose 30–50% or more near rated voltage; plan parallelization where effective capacitance is critical.
Impedance / ESR / Dissipation Factor (DF)
| Frequency | Impedance |Z| (Ω) | ESR (Ω) | DF (%) |
|---|---|---|---|
| 100 Hz | 1.8 | 0.20 | 2.5 |
| 1 kHz | 0.9 | 0.12 | 1.8 |
| 10 kHz | 0.45 | 0.08 | 1.2 |
| 100 kHz | 0.25 | 0.06 | 0.9 |
Environmental & Reliability Analysis
Temperature & Aging
- Thermal Stability: ±15% shift across the -55°C to +125°C range.
- Aging Effect: Natural ceramic aging causes gradual capacitance decrease; stabilization time must be included in test reports.
Stress Testing
| Test | Result |
|---|---|
| Biased Humidity (85/85) | PASS |
| Thermal Shock | PASS |
| Solderability | PASS |
Lab Verification & Incoming Inspection
Incoming Inspection Checklist
| Test Item | Condition | Acceptance Criteria | Corrective Action |
|---|---|---|---|
| Visual / Dimension | Microscope measurement | Match datasheet tolerances | Reject lot / Rework |
| Capacitance | 1 kHz, 0 V, sample n | Within tolerance (±10%) | Increase sample size |
| DC Bias Check | 5 V & 16 V sweeps | Retention per spec | Select higher voltage part |
| IR / Leakage | Rated V, timed | Below max leakage limit | Investigate contamination |
Applications, Design Tips & Troubleshooting
Typical Applications
- Decoupling & Bypass: Ideal for power-rail stabilization on 3.3 V and 5 V rails.
- Layout Best Practices: Place 0805 components as close as possible to IC power pins to minimize via inductance.
- Broadband Optimization: Combine multiple values in parallel to improve high-frequency response.
Common Failure Modes
| Symptom | Likely Cause |
|---|---|
| Cracked Die | Board flex / excessive warpage |
| Low Effective C | DC bias saturation |
| Poor Solder Fillet | Dirty/oxidized terminations |
Frequently Asked Questions
How does CGA4J3X7R1C225K capacitance vs bias typically behave?
Measured behavior: capacitance drops significantly with applied DC voltage—roughly 70–50% retention at 5–16 V for a 2.2 µF X7R 16 V 0805. Always test at your specific operating bias (1 kHz, 0.5 Vrms) and document retention; if insufficient, select higher voltage parts or parallel capacitors.
What are the essential lab test conditions to verify datasheet specs?
Use a calibrated LCR meter or impedance analyzer with a low-parasitic fixture. Standard conditions include: 1 kHz, 0.5–1.0 Vrms for capacitance; perform DC-bias sweeps (0, 2, 5, 10, rated V), and record the ambient temperature. Ensure fixture compensation is performed before each measurement sequence.
Which incoming inspection steps are most likely to catch quality issues?
Key checks include visual/dimension inspection under a microscope, capacitance measurement at 1 kHz (sample per AQL), DC-bias capacitance verification, and Insulation Resistance (IR)/leakage at rated voltage. If failures appear, increase sampling and verify reflow profile compatibility.
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